Home > Candidates > Nikolay Bodunov
Nikolay Bodunov

Moscow Moscow, Russia

Phone: xxx-xxx-xxxx

Email: xxx@xxxx.xxx



  • Looking For: Hardware Engineer, ODM R&D Hardware Manager

  • Occupation: Architecture and Engineering

  • Degree: Master's Degree

  • Career Level: Experienced

  • Languages: English (advanced), German (beginner)

Career Information:

Sign up to view Nikolay Bodunov's full profile.

Highlights:

Skills:motherboard, pcie, ODM

Certification:PMP Exam Certification, 2009 PMI Institute, PMP Certificate


Experiences:

ODM R&D Manager 01/2014 - current
Auriga, Inc, Moscow, Moscow Russia
Industry: R&D hardware
Control R&D activities for ODM Team (Tablet PC, 15.6" 4K display, Skylake processor). Project includes development of electronics, software, mechanics and cooling system. Project is finished.
The tablet acts as a control monitor (ViewFinder) for 4K professional video camera (Canon C500, etc.). It uses Intel embedded GPU core for unpack 4K video data stream from 3G-SDI interface. Processor gets data stream via PCIe2. Bridge 3G-SDI->PCIe implemented on FPGA Xilinx Kintex-7. 4G DDR3-800 onboard memory used for intermediate data buffer. The tablet powered from included SmartBattery (SMBus control). Detailed project description is available on: http://bodunov.space/areas/electronics/tablet-development Engineering responsibilities: - transfer for next device generation with minimum engineering efforts - write UEFI BIOS testing modules in EDK2 (DXE phase) - partial board bring-up (video&power subsystems) - engineering control of deliverables Management Responsibilities - write SOW with technical specs - budgeting - cost and price optimization for vendor services - schedule control (the tablet was released exactly at described date) - looking for additional outsourcing services (thermal simulation, FPGA & drivers development) - travel to support and control outsourcing activities, validate design phases - order custom-developed parts (touchscreens, hi-speed data cables, etc.) on China and Taiwan’s factories - logistics, logistics, endless logistics…--
Electronic Hardware R&D Team Lead 05/2011 - 12/2013
T-Platforms, Moscow, Moscow Russia
Industry: Electronics Hardware
Development HPC Rack “A-Class” with hot water cooling, fastest in Russia (300 TFlops) Rack 2400x1500x800 mm with 256 hybrid compute nodes Intel Sandy/Ivy Bridge + NVidia Kepler K20/Intel Xeon Phi GPUs. InfiniBand FDR 4X interconnect. 140 kW power consumption. 8 engineers onsite, 10 outsource/ODM teams from USA, UK, Italy, China, Taiwan, Israel, Germany
Engineering responsibilities (on initial phase): - writing tech specs for system components (server boards with GPU, InfiniBand/Ethernet switches, backplanes, custom DDR3 memory modules, water-cooled coldplates 2.2 kW) - co-work with CFD modeling with subcontractors, co-design coldplates and electronic boards - define mechanics, power (24kW DC) and SERDES (IB FDR) propagation inside a backplane board - describe BMC firmware features in addition to AMI MegaRAC built-in ones (events logging, BIOS and BMC FW remote mass updates, FRU operations) - define power generation, distribution and control schemes inside the rack (140 kW) - define power consumption measurement scheme to acquire consumption for separate components on server board: CPU, Memory, GPU, other logic - describe testing custom equipment for debug and testing system components Management responsibilities: - work with various ODM/OEM cross-functional teams (from NVidia, Micron, MSI, Mellanox, etc.) -customizing mass production devices for needs of the project - travel to verify and support engineering activities on ODMs and outsourcers sites - communication with infrastructure engineers (water, cooling, power) for datacenter creation - planning and tracking supply chains and logistics operations - headhunting and couching engineers Project description on my and company’s web sites: http://bodunov.space/areas/electronics/supercomputer-rack-development https://www.t-platforms.ru/images/pdf_a-class/A-Class%20family%20presentation.pdf My patents in the project: Cooling System patent: http://bodunov.space/images/Cooling.pdf DDR3 Custom Memory module patent: http://bodunov.space/images/DDR3_Module.pdf--
R&D Project Manager 09/2005 - 10/2009
Lebedev Institute of Precision Mechanics and Computer Engineering, Moscow, Moscow Russia
Industry: Computer hardware
R&D manager, embedded hardware and software projects Create R&D development teams from scratch Communication with scientists Write SOW, Project Charter, fast financial analysis/forecasts using MS Project
Biotelemetry system for cardiac monitoring of small laboratory animals (usually rats) 4 people in office, 3 people in outsourcing team In connection with Faculty of Medicine, Moscow State University System composed of implantable module and receiver gate Implantable telemetric module provides continuous cardiac monitoring and transmits data via radio channel to a nearby transceiver. Physical module dimensions are 15x20x8 mm. Detailed description: http://bodunov.space/areas/electronics/medical-devices-development Avionic embedded system to control jet engine 4 people in office, 2 people in outsourcing team Detailed description on Russian: http://www.ipmce.ru/img/release/sau.pdf--

Education:

N.E.Bauman Moscow State Technical University 09/1988 - 06/1994
Moscow, Moscow, Russia
Degree: Master's Degree
Major:Mechnical Engineering
Diploma: Development of technological processes for mass production of metal parts manufacturing


M.V.Lomonosov Moscow State University 09/1995 - 06/1998
Moscow, Moscow, Russia
Degree: Master's Degree
Major:Software Engineer
Minor:HPC systems
Diploma: Phone line modem signal simulation (DSP)

Download Resume(Available to Employers Only):

Login to view resume: R&D Team Lead - Linux Drivers, Electronics, Mechanics



More About Nikolay Bodunov
Please sign in or sign up an employer to view Nikolay Bodunov's personal information.

  • Phone: xxx-xxx-xxxx
  • Email:xxx@xxxx.xxx
  • Visa: -
  • Work Authorization: -
  • Expected Salary: -
  • Intests & Hobbies: -